Integrated Network Solutions Manufacturing

As our customers seek to develop products that provide greater functionality and are smaller in size, enhanced manufacturing technologies and processes are increasingly required. Our investments in advanced manufacturing equipment, as well as our experience and expertise in innovative miniaturization, packaging and interconnect technologies allows us to offer a variety of advanced manufacturing solutions. With manufacturing sites in 30 countries, our global footprint enables our customers to deliver their products to market faster.

Within these operations, we employ just-in-time, ship-to-stock and ship-to-line programs, continuous flow manufacturing, demand flow processes and statistical process controls. We also support a wide range of product demand profiles; from low-volume, high-complexity programs to high-volume production. For many of our projects, we assemble electronics products with our proprietary printed circuit boards and custom electronic enclosures on either a build-to-order or configure-to-order basis. Continuous focus on lean manufacturing allows us to increase our efficiency and flexibility to meet our customers’ dynamic requirements.

Service Highlights

Our Integrated Network Solutions customers are global, but their markets differ regionally and even locally. So when it comes to our global footprint, one factor rules all others: we locate facilities and capabilities where we competitively add the most value for our customers

Integrated Network Solutions operates dedicated manufacturing and system integration facilities around the world in locations like Brazil, China, India, Malaysia, Mexico, Poland and the United States. Each operation has implemented a rigorous Lean culture, common tools and shared best practices and metrics to drive continuous improvement while ensuring that we maintain best in class operations.

Our goal is to deliver the lowest landed cost, including logistics, shipping, production and opportunity costs associated with reliability and time-to-market. That's why we have facilities dedicated to our markets in Asia, Europe and the Americas and why we utilize our Industrial Parks in low cost geographies. Not only does this support OEMs’ aim of maximizing manufacturing in low cost countries, it also brings the added benefit of combining design, printed circuit board assembly, enclosure fabrication, integration and final assembly and test with fully integrated global logistics services, reducing supply chain touches, lead-time and cost.

Our Industrial Parks in Malaysia, Texas, Mexico and Poland are well positioned to support high and low volume production and low to high complexity products. We assemble highly complex products near our customers' end-markets – often integrating circuit boards and subsystems manufactured in cost-competitive regions – to ensure the most cost-effective manufacturing solution.

The Flextronics Industrial Park Model significantly improves supply chain response time and customer lead-time, while eliminating ERP hand-off – especially from one company to another – removes latency in communication. Industrial Parks also eliminate inter-site transportation costs, packaging, buffer inventory through the supply chain. They offer build-to-order, configure-to-order and build-to-stock capability and their continuous focus on lean manufacturing increases efficiency and flexibility. Industrial Parks deliver global scale and repeatability, while maximizing flexibility and agility for our customers

At Flextronics, global means serving our customers in an integrated and coordinated way. This approach enables us to execute with greater precision, economic leverage and flexibility to provide integrated supply chain services that deliver the best value to our customers.

Enclosures

We offer a comprehensive set of custom electronics enclosures and related products and services to customers around the globe. Our services include the design, manufacture and integration of electronics packaging systems. This includes custom enclosure systems, power and thermal subsystems, interconnect subsystems, cabling and cases. In addition to standard sheet metal and plastic fabrication services, we assist in the design of electronics packaging systems that protect sensitive electronics and enhance functionality. Our enclosure design services focus on functionality, manufacturability and testing. These services are integrated with our other assembly and manufacturing services to provide our customers with overall improved supply chain management.

Testing Services

Our computer-aided testing services for assembled printed circuit boards, systems and subsystems significantly improve our ability to deliver high-quality products on a consistent basis. Our test services include management defect analysis, in-circuit and functional testing and environmental stress tests of board and system assemblies. Additionally, we offer design for test, design for manufacturing, and design for environment services to jointly improve customer product design and manufacturing.

Materials Procurement and Inventory Management

Our manufacturing and assembly operations capitalize on our materials inventory management expertise and volume procurement capabilities. As a result, we are able to achieve highly competitive cost reductions and total manufacturing cycle time for our customers. Our materials procurement and management services include planning, purchasing, expediting and warehousing of components and materials used in the manufacturing process. In addition, our Industrial Park strategy optimizes efficiency by co-locating third-party suppliers of custom components with our manufacturing facilities to reduce material and transportation costs, simplify logistics and facilitate inventory management.