Communications

As the industry’s largest telecommunications infrastructure electronics manufacturing services (EMS) provider, we offer a unique insight into the market and its future direction with regard to supply chain excellence. Interfacing with both large and small customers in all geographies with various supply chain models has allowed us to develop industry-leading end-to-end capabilities which have been recognized by our customers as best-in-class.

We have invested heavily in creating a global IT architecture and deployed this throughout our business. This enables real-time communication and data to be shared across the supply chain, thereby creating the B2B communications that enable us to respond dynamically to the ever-changing supply chain demand.

Flextronics is uniquely qualified among EMS providers in the breadth, depth of service and product experience we bring to customers in the telecommunications infrastructure market. Our size and scale fits well with customer requirements where there is a need for global solutions, and our established vertically integrated campus footprint enables us to engineer and create agile supply chain solutions in any geography.

Flextronics understands that the key to agility is the ability to quickly provide information that enables intelligent business decisions that can be rapidly executed upstream and downstream in the supply chain. Over the past ten years, Flextronics has invested heavily in a global system that was initially intended to improve our own business performance. This has evolved into a customer service enabler that provides a seamless B2B interface and interactive view of the supply chain from end-to-end.

Flextronics has invested in and deployed a global operations strategy to significantly reduce lead-time and supply chain response time. It occurs in low-cost geographies and combines all of the major components required for telecommunications products to be sourced from either Flextronics vertical components or a local Flextronics qualified supply base. We have also invested heavily in bringing complex system assembly build-to-order/configure-to-order (BTO/CTO) and DOF capabilities on site, which has become a well-established competency. Our campuses include printed circuit board assembly and module assembly, enclosure fabrication, cable manufacturing, system integration, BTO/CTO (lot size of 1), DOF and repair/reverse logistics management.